Zero ASIC ·
UT Austin awarded $850M by DARPA to advance 3D chip design
Zero ASIC is excited to be part of the University of Texas at Austin led team developing the next generation of high-performing semiconductor microsystems for the Department of Defense. Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense. Under the agreement, TIE will establish a national open access R&D and prototyping fabrication facility that will enable DOD to create higher performance, lower power, light weight and compact defense systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems.
Team Members:
Adeia, AMD, Ansys, Applied Materials, BAE Systems, Boeing, Cadence, Canon, Cerium Labs, Deca, Electroninks, Global Foundries, HRL Laboratories, IMEC, Infleqtion, Intel, Kepler Computing, Lockheed Martin, Micron, Micross, Northrop Grumman, Qorvo, Raytheon, Sandbox Semiconductor, Siemens, Skywater, Synopsys, Teledyne, 3D Glass Solutions, Tower Semiconductor, Zero ASIC