Career Opportunities

We are always looking for outstanding new team members. If you think you can help us lower the barrier to silicon, we encourage you to send a resume and intro to work@zeroasic.com.

Zero ASIC does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. Zero ASIC is an equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status.

Director of Advanced Packaging

As the director of advanced packaging you will lead the development of heterogeneous system-in-package architectures and partnerships to address high volume and long tail manufacturing needs.


Responsibilities:


  • Lead the development of novel package architectures and manufacturing flows for the company’s heterogeneous system in package approach.

  • Work with OSATs and other partners to bring solutions from concept to high volume manufacturing .

  • Recruit and manage a team of internal individual contributors and external consultants to support high volume manufacturing.      

  • Collaborate with the internal SoC design and architecture teams and external organization to define electrical, protocol, reliability, mechanical, and test standards for advanced packaging.

  • Collaborate with the SoC architecture and design team to converge on package architectures that 


Requirements:


  • PhD or Master’s Degree in the technical subject area.

  • 10+ years of experience in advanced semiconductor packaging

  • Experience with high volume SoC product manufacturing (>1M units)

  • Domain expertise in SoC reliability (ESD, EM, reliability, material compatibility, coplanarity controls, warpage mitigation, board interfaces).

  • Domain expertise in flip-chip, WLFO, 2.5D/3D, silicon interposers, advanced build up substrates, underfill, heatsinks, board.

  • Domain expertise in package signal integrity and power delivery, 

  • Demonstrated success in low product cost optimization through appropriately constraining architecture, materials, vendors.

  • Strong ties to the advanced packaging industry community.   

  • Outstanding collaboration skills

Senior Compiler Engineer

As a senior compiler engineer at Zero ASIC you will lead internal development of compiler infrastructure for our RISC-V based state of the art accelerators.


Responsibilities:

  • Lead the development of compilers for RISC-V based accelerators.

  • Collaborate with the hardware development team to optimize the architecture, working in a tight/agile hw/sw loop.

  • Develop early prototypes and present to potential system customers.


Requirements:

  • BS/MS or PhD in Computer Science or related field.

  • 3+ years of industry experience (or equivalent academic research experience)

  • Demonstrated ability in building successful compilers for industry or research. 

  • Hands-on experience with developing front-ends/back-ends for GCC or LLVM.

  • Experience with open source collaboration.

  • Strong background in computer architecture.

  • Strong background in compiler theory, algorithms, and optimization techniques.

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SoC Project Leader

As an SoC Project Leader you will lead a team of engineers in the development of Zero ASIC’s leading edge products.


Responsibilities:


  • Drive the development of a chip product from definition, through RTL, design verification, physical implementation, and post silicon bringup.

  • Continuously refine the product architecture and implementation to derive a set of minimal features that meets the required goals for performance, flexibility, power, performance, cost, and ease of use.

  • Lead a distributed team of digital designers, physical designers, and software developers to drive the design to production.  


Requirements:

  • Bachelor’s degree in Computer Science, Electrical Engineering, or related field.

  • 10+ years of in advanced technology SoC design.

  • Proven track record full cycle development from planning to deployment.

  • Experience in all phases of design from architecture to post silicon bringup.

  • Multiple successful tape outs at 22nm and below.

  • Strong interpersonal, teamwork, and communication skills

  • Team leadership experience

Digital IC Designer

As a digital IC designer at Zero ASIC you will have the unique opportunity to drive design from inception all the way to production.


Responsibilities:


  • Drive the development of SoC blocks and subsystems from definition, through RTL, design verification, physical implementation, and post silicon bringup

  • Continuously refine the architecture and implementation to derive a set of minimal features that meets the required goals for performance, flexibility, power, performance, cost, and ease of use

  • Develop generators and automation frameworks to maximize future reuse potential

  • Collaborate with the physical design team and design verification team to design a high quality product that is optimized for power, speed, reliability, and ease of use

  • Collaborate with the application and post silicon bringup team to develop test vectors and driver software, ensuring that the block can be effectively used in the eventual SoC product


Requirements:


  • Bachelor’s degree in Computer Science, Electrical Engineering, or related field

  • Experience with micro-architecture development and RTL design

  • Strong grasp of computer architecture

  • Strong programming skills

  • Strong interpersonal, teamwork, and communication skills

  • Highly creative and self-driven