Career Opportunities

We are always looking for outstanding new team members. If you think you can help us lower the barrier to silicon, we encourage you to send a resume and intro to work@zeroasic.com.

Director of Advanced Packaging

As the director of advanced packaging you will lead the development of heterogeneous system-in-package architectures and partnerships to address high volume and long tail manufacturing needs.


Responsibilities:


  • Lead the development of novel package architectures and manufacturing flows for the company’s heterogeneous system in package approach.

  • Work with OSATs and other partners to bring solutions from concept to high volume manufacturing .

  • Recruit and manage a team of internal individual contributors and external consultants to support high volume manufacturing.      

  • Collaborate with the internal SoC design and architecture teams and external organization to define electrical, protocol, reliability, mechanical, and test standards for advanced packaging.

  • Collaborate with the SoC architecture and design team to converge on package architectures that 


Requirements:


  • PhD or Master’s Degree in the technical subject area.

  • 10+ years of experience in advanced semiconductor packaging

  • Experience with high volume SoC product manufacturing (>1M units)

  • Domain expertise in SoC reliability (ESD, EM, reliability, material compatibility, coplanarity controls, warpage mitigation, board interfaces).

  • Domain expertise in flip-chip, WLFO, 2.5D/3D, silicon interposers, advanced build up substrates, underfill, heatsinks, board.

  • Domain expertise in package signal integrity and power delivery, 

  • Demonstrated success in low product cost optimization through appropriately constraining architecture, materials, vendors.

  • Strong ties to the advanced packaging industry community.   

  • Outstanding collaboration skills

  • US citizenship

SoC Project Leader

As an SoC Project Leader you will lead a team of engineers in the development of Zero ASIC’s leading edge products.


Responsibilities:


  • Drive the development of a chip product from definition, through RTL, design verification, physical implementation, and post silicon bringup.

  • Continuously refine the product architecture and implementation to derive a set of minimal features that meets the required goals for performance, flexibility, power, performance, cost, and ease of use.

  • Lead a distributed team of digital designers, physical designers, and software developers to drive the design to production.  


Requirements:

  • Bachelor’s degree in Computer Science, Electrical Engineering, or related field.

  • 10+ years of in advanced technology SoC design.

  • Proven track record full cycle development from planning to deployment.

  • Experience in all phases of design from architecture to post silicon bringup.

  • Multiple successful tape outs at 22nm and below.

  • Strong interpersonal, teamwork, and communication skills

  • Team leadership experience

  • US Citizenship

Digital IC Designer

As a digital IC designer at Zero ASIC you will have the unique opportunity to drive design from inception all the way to production.


Responsibilities:


  • Drive the development of SoC blocks and subsystems from definition, through RTL, design verification, physical implementation, and post silicon bringup

  • Continuously refine the architecture and implementation to derive a set of minimal features that meets the required goals for performance, flexibility, power, performance, cost, and ease of use

  • Develop generators and automation frameworks to maximize future reuse potential

  • Collaborate with the physical design team and design verification team to design a high quality product that is optimized for power, speed, reliability, and ease of use

  • Collaborate with the application and post silicon bringup team to develop test vectors and driver software, ensuring that the block can be effectively used in the eventual SoC product


Requirements:


  • Bachelor’s degree in Computer Science, Electrical Engineering, or related field

  • Experience with micro-architecture development and RTL design

  • Strong grasp of computer architecture

  • Strong programming skills

  • Strong interpersonal, teamwork, and communication skills

  • Highly creative and self-driven

Program Manager

As a program manager at Zero ASIC you will have broad responsibilities for government programs and commercial customer engagements. 

Responsibilities:

  • Liaison and direct point of contact for customer

  • Contract negotiation and management

  • Program execution and schedule tracking

  • Tracking of project funding and billing 

  • Lead/support for proposal efforts

  • Preparation of customer project deliverables

  •  reporting to customer

  • Tracking compliance of all contract terms

Requirements:


  • Bachelor's degree in a technical or business related discipline

  • 5+ years of program management experience 

  • Excellent collaboration skills

  • Excellent organizational skills and work ethic

  • US citizenship

Senior Physical Design Engineer

As a senior physical designer you will  develop highly automated design flows  to reduce the barrier to silicon for everyone.


Responsibilities:

  • Lead the development of state of the art automated physical design methodologies.

  • Lead back-end SoC implementation efforts from RTL to tapeout/packaging.

  • Work effectively with RTL design team, firmware team, and customers on agile SoC development projects.


Requirements:

  • BS in EE/CE and 5+ years of experience (or equivalent) in SoC physical design.

  • Experience with multiple successful commercial tapeouts at advanced process nodes(16nm and below required, 7nm or smaller preferred).

  • Strong working knowledge of back-end tools and flows – floor planning, P&R, timing, power, EMIR, DFM, DFT, clocking, power grid analysis, thermal, physical verification, synthesis, and sign-off.

  • Experience with integration of complex high speed 3rd party mixed signal IP.

  • Strong programming and scripting skills (TCL, Python).

  • Strong communication skills.

  • Highly creative and self-driven.

  • US citizenship or permanent residency.

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